All Jobs

Title Ref. ID Location Date Sort ascending
Principal Engineer / Associate Principal Engineer / Senior Lead Engineer / Lead Engineer, FinTech CTO/AITT/SSP/1963 HK 13 Jul 2026
Associate Principal Engineer/Senior Lead Engineer/Lead Engineer, Machine Learning CTO/AITT/MSA/2246 HK 14 Jul 2026
Senior Lead Engineer/Lead Engineer, 3D Package CTO/AECS/HIT/2340 HK 15 Jul 2026
Senior Engineer/ Engineer/ Engineering Associate (PI), FinTech Software Development CTO/AITT/ACSS/2041 HK 15 Jul 2026
Senior Engineer / Engineer, Networking Software CTO/CT/NSOFT/2107 HK 15 Jul 2026
Senior Engineer (PI) / Engineer (PI) / Engineering Associate (PI), Networking Software CTO/CT/NSOFT/2106 HK 15 Jul 2026
Senior Engineer/Engineer, 3D Package CTO/AECS/HIT/2341 HK 15 Jul 2026
Senior Engineer/ Engineer (PI), Software Development and Machine Learning CTO/AITT/CLI/2123 HK 17 Jul 2026
Deputy Director, Ecosystem and Channel CCO/ECS/ECS/2294 HK 18 Jul 2026
Lead Engineer/ Senior Engineer/ Engineer, Front End Development CTO/AIPS/DATA/2288 HK 19 Jul 2026
Senior Engineer/Engineer, Electroplating Copper Process Technology for TGV/TSV/PCB CTO/AECS/HIT/2249 CN 20 Jul 2026
Officer, Accounting, Reporting and Budgeting CFO/AC/AC/2322 HK 21 Jul 2026
Senior Manager, Accounting, Reporting and Budgeting CFO/AC/AC/2304 HK 22 Jul 2026
FPGA Design - Principal Engineer / Lead Engineer / Senior Engineer / Engineer CTO/CT/BSOL/920 HK 23 Jul 2026
Senior Engineer/Engineer, Glass-based Semiconductor Process Technology CTO/AECS/HIT/2215 CN 23 Jul 2026
5G/6G Embedded Systems Design - Principal Engineer / Lead Engineer / Senior Engineer / Engineer CTO/CT/BSOL/900 HK 23 Jul 2026
Officer, Accounting, Reporting and Budgeting CFO/AC/AC/2309 HK 24 Jul 2026
Engineer / Engineering Associate, Embedded System Design CTO/CT/BSOL/2019 HK 25 Jul 2026
Senior Manager/ Manager I, Mainland Client Development CCO/ISAC/ISAC/2259 HK 26 Jul 2026
Associate Principal Engineer / Senior Lead Engineer / Lead Engineer, AI System Development CTO/IOTSAI/IMV/2164 HK 26 Jul 2026
Senior Lead Engineer/Lead Engineer, Digital IC Design CTO/AECS/ICET/2166 HK 27 Jul 2026
Chief Engineer, Advanced Packaging CTO/AECS/HIT/2185 HK 27 Jul 2026
Lead Engineer, Machine Learning Algorithm and Software CTO/AECS/ICET/2161 HK 27 Jul 2026